home *** CD-ROM | disk | FTP | other *** search
Text File | 1988-01-27 | 92.7 KB | 3,829 lines |
-
-
-
-
-
-
- 1
-
-
- SPICE 3A6 User's Guide
-
- December 15, 1985
-
- T. Quarles
- A.R.Newton, D.O.Pederson, A.Sangiovanni-Vincentelli
-
- Department of Electrical Engineering and Computer Sciences
- University of California
- Berkeley, Ca., 94720
-
-
-
- ____________________________________________________
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
- 2
-
-
- | |
- | Please Note |
- | |
- | |
- | This is an update to the first release of|
- | SPICE3 and the development of SPICE and its algo-|
- | rithms is ongoing at Berkeley. We believe that|
- | all of the features described here are fully func-|
- | tional; however, not all of the intended capabili-|
- | ties of the program have been implemented in full|
- | yet. Please mail any reports of suspected bugs in|
- | the program or suggested enhancements to the pro-|
- | gram to: |
- | |
- | EECS/ERL Industrial Support Office |
- | 461 Cory Hall |
- | U.C. Berkeley |
- | Berkeley, Ca. 94720 |
- | |
- | or by electronic mail to: |
- | |
- | spice@cad.BERKELEY.EDU (ARPAnet, CSnet) |
- | ucbvax!ucbcad!spice (UUCPnet) |
- | |
- | |
- | Please include input to the program, out- |
- | put, suggestions as to where the problem may |
- | be, and if possible, a suggested fix! |
- | |
- | SPICE3 has been in beta-test since April |
- | 1985 and has been in use at over twenty sites. |
- | This version is the result of our own work at |
- | Berkeley and the feedback we have received |
- | from our beta sites. We thank them for their |
- | help. |
- |___________________________________________________|
-
-
-
-
- SPICE is a general-purpose circuit simulation program for
-
- nonlinear dc, nonlinear transient, and linear ac analyses. Cir-
-
- cuits may contain resistors, capacitors, inductors, mutual induc-
-
- tors, independent voltage and current sources, four types of
-
- dependent sources, transmission lines, and the four most common
-
-
-
-
-
-
-
-
-
-
-
-
-
-
- 3
-
-
- semiconductor devices: diodes, BJT's, JFET's, and MOSFET's.
-
-
- The SPICE3 version is based directly on SPICE 2G.6. While
-
- SPICE3 is being developed to include new features, it will con-
-
- tinue to support those capabilities and models which remain in
-
- extensive use in the SPICE2 program.
-
-
- SPICE has built-in models for the semiconductor devices, and
-
- the user need specify only the pertinent model parameter values.
-
- The model for the BJT is based on the integral charge model of
-
- Gummel and Poon; however, if the Gummel- Poon parameters are not
-
- specified, the model reduces to the simpler Ebers-Moll model. In
-
- either case, charge storage effects, ohmic resistances, and a
-
- current-dependent output conductance may be included. The diode
-
- model can be used for either junction diodes or Schottky barrier
-
- diodes. The JFET model is based on the FET model of Shichman and
-
- Hodges. Four MOSFET models are implemented: MOS1 is described by
-
- a square-law I-V characteristic, MOS2[1] is an analytical model,
-
- while MOS3[1] is a semi-empirical model, and MOS4[2,3] is the new
-
- BSIM (Berkeley Short-channel IGFET Model). MOS2, MOS3, and MOS4
-
- include second-order effects such as channel length modulation,
-
- subthreshold conduction, scattering limited velocity saturation,
-
- small-size effects, and charge-controlled capacitances.
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
- 4
-
-
- 1. TYPES OF ANALYSIS
-
-
-
- 1.1. DC Analysis
-
-
-
- The dc analysis portion of SPICE determines the dc operating
-
- point of the circuit with inductors shorted and capacitors
-
- opened. A dc analysis is automatically performed prior to a
-
- transient analysis to determine the transient initial conditions,
-
- and prior to an ac small-signal analysis to determine the linear-
-
- ized, small-signal models for nonlinear devices. The dc analysis
-
- can also be used to generate dc transfer curves: a specified
-
- independent voltage or current source is stepped over a user-
-
- specified range and the dc output variables are stored for each
-
- sequential source value.
-
-
-
- 1.2. AC Small-Signal Analysis
-
-
- The ac small-signal portion of SPICE computes the ac output
-
- variables as a function of frequency. The program first computes
-
- the dc operating point of the circuit and determines linearized,
-
- small-signal models for all of the nonlinear devices in the cir-
-
- cuit. The resultant linear circuit is then analyzed over a
-
- user-specified range of frequencies. The desired output of an ac
-
- small- signal analysis is usually a transfer function (voltage
-
- gain, transimpedance, etc). If the circuit has only one ac
-
- input, it is convenient to set that input to unity and zero
-
-
-
-
-
-
-
-
-
-
-
-
-
- 5
-
-
- phase, so that output variables have the same value as the
-
- transfer function of the output variable with respect to the
-
- input.
-
-
-
- 1.3. Transient Analysis
-
-
-
- The transient analysis portion of SPICE computes the tran-
-
- sient output variables as a function of time over a user-
-
- specified time interval. The initial conditions are automati-
-
- cally determined by a dc analysis. All sources which are not
-
- time dependent (for example, power supplies) are set to their dc
-
- value. The transient time interval is specified on a .TRAN con-
-
- trol line.
-
-
-
-
-
- 2. CONVERGENCE
-
-
-
- Both dc and transient solutions are obtained by an iterative
-
- process which is terminated when both of the following conditions
-
- hold:
-
-
- 1) The nonlinear branch currents converge to within a tolerance
-
- of 0.1 percent or 1 picoamp (1.0E-12 Amp), whichever is
-
- larger.
-
-
- 2) The node voltages converge to within a tolerance of 0.1 per-
-
- cent or 1 microvolt (1.0E-6 Volt), whichever is larger.
-
-
-
-
-
-
-
-
-
-
-
-
- 6
-
-
- Although the algorithm used in SPICE has been found to be
-
- very reliable, in some cases it will fail to converge to a solu-
-
- tion. When this failure occurs, the program will terminate the
-
- job.
-
-
- Failure to converge in dc analysis is usually due to an
-
- error in specifying circuit connections, element values, or model
-
- parameter values. Regenerative switching circuits or circuits
-
- with positive feedback probably will not converge in the dc
-
- analysis unless the OFF option is used for some of the devices in
-
- the feedback path, or the .NODESET card is used to force the cir-
-
- cuit to converge to the desired state.
-
-
-
-
-
- 3. INPUT FORMAT
-
-
-
- The input format for SPICE is of the free format type.
-
- Fields on a card are separated by one or more blanks, a comma, an
-
- equal (=) sign, or a left or right parenthesis; extra spaces are
-
- ignored. A card may be continued by entering a + (plus) in
-
- column 1 of the following card; SPICE continues reading begin-
-
- ning with column 2.
-
-
- A name field must begin with a letter (A through Z) and can-
-
- not contain any delimiters.
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
- 7
-
-
- A number field may be an integer field (12, -44), a floating
-
- point field (3.14159), either an integer or floating point number
-
- followed by an integer exponent (1E-14, 2.65E3), or either an
-
- integer or a floating point number followed by one of the follow-
-
- ing scale factors:
-
-
-
- T=1E12 G=1E9 MEG=1E6 K=1E3 MIL=25.4E-6
- M=1E-3 U=1E-6 N=1E-9 P=1E-12 F=1E-15
-
-
- Letters immediately following a number that are not scale factors
-
- are ignored, and letters immediately following a scale factor are
-
- ignored. Hence, 10, 10V, 10VOLTS, and 10HZ all represent the
-
- same number, and M, MA, MSEC, and MMHOS all represent the same
-
- scale factor. Note that 1000, 1000.0, 1000HZ, 1E3, 1.0E3, 1KHZ,
-
- and 1K all represent the same number.
-
-
-
-
-
- 4. CIRCUIT DESCRIPTION
-
-
-
- The circuit to be analyzed is described to SPICE by a set of
-
- element cards, which define the circuit topology and element
-
- values, and a set of control cards, which define the model param-
-
- eters and the run controls. The first card in the input deck
-
- must be a title card, and the last card must be a .END card. The
-
- order of the remaining cards is arbitrary (except, of course,
-
- that continuation cards must immediately follow the card being
-
-
-
-
-
-
-
-
-
-
-
-
-
-
- 8
-
-
- continued).
-
-
- Each element in the circuit is specified by an element card
-
- that contains the element name, the circuit nodes to which the
-
- element is connected, and the values of the parameters that
-
- determine the electrical characteristics of the element. The
-
- first letter of the element name specifies the element type. The
-
- format for the SPICE element types is given in what follows. The
-
- strings XXXXXXX, YYYYYYY, and ZZZZZZZ denote arbitrary
-
- alphanumeric strings. For example, a resistor name must begin
-
- with the letter R and can contain one or more characters. Hence,
-
- R, R1, RSE, ROUT, and R3AC2ZY are valid resistor names.
-
-
- Data fields that are enclosed in less than and greater than
-
- signs '< >' are optional. All indicated punctuation
-
- (parentheses, equal signs, etc.) is optional and merely indicate
-
- the presence of any delimiter. A consistent style such as that
-
- shown here will make the input easier to understand. With
-
- respect to branch voltages and currents, SPICE uniformly uses the
-
- associated reference convention (current flows in the direction
-
- of voltage drop).
-
-
- Nodes names may be arbitrary character strings. The datum
-
- (ground) node must be named '0'. The circuit cannot contain a
-
- loop of voltage sources and/or inductors and cannot contain a
-
- cutset of current sources and/or capacitors. Each node in the
-
- circuit must have a dc path to ground. Every node must have at
-
-
-
-
-
-
-
-
-
-
-
-
-
- 9
-
-
- least two connections except for transmission line nodes (to per-
-
- mit unterminated transmission lines) and MOSFET substrate nodes
-
- (which have two internal connections anyway).
-
-
-
-
-
- 5. TITLE CARD, COMMENT CARDS AND .END CARD
-
-
-
- 5.1. Title Card
-
-
- Examples:
-
-
- POWER AMPLIFIER CIRCUIT
- TEST OF CAM CELL
-
-
-
- This card must be the first card in the input deck. Its
-
- contents are printed verbatim as the heading for each section of
-
- output.
-
-
-
- 5.2. .END Card
-
- Examples:
-
-
- .END
-
-
-
- This card must always be the last card in the input deck.
-
- Note that the period is an integral part of the name.
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
- 10
-
-
- 5.3. Comment Card
-
-
- General Form:
-
-
- * <any comment>
-
-
- Examples:
-
-
- * RF=1K GAIN SHOULD BE 100
- * MAY THE FORCE BE WITH MY CIRCUIT
-
-
-
- The asterisk in the first column indicates that this card is
-
- a comment card. Comment cards may be placed anywhere in the cir-
-
- cuit description.
-
-
-
-
-
- 6. ELEMENT CARDS
-
-
-
- 6.1. Resistors
-
- General form:
-
-
- RXXXXXXX N1 N2 VALUE
-
-
- Examples:
-
-
- R1 1 2 100
- RC1 12 17 1K
-
-
-
- N1 and N2 are the two element nodes. VALUE is the resis-
-
- tance (in ohms) and may be positive or negative but not zero.
-
-
-
-
-
-
-
-
-
-
-
-
-
- 11
-
-
- 6.2. Capacitors and Inductors
-
-
- General form:
-
-
- CXXXXXXX N+ N- VALUE <IC=INCOND>
- LYYYYYYY N+ N- VALUE <IC=INCOND>
-
-
- Examples:
-
-
- CBYP 13 0 1UF
- COSC 17 23 10U IC=3V
- LLINK 42 69 1UH
- LSHUNT 23 51 10U IC=15.7MA
-
-
-
- N+ and N- are the positive and negative element nodes,
-
- respectively. VALUE is the capacitance in Farads or the induc-
-
- tance in Henries.
-
-
- For the capacitor, the (optional) initial condition is the
-
- initial (time-zero) value of capacitor voltage (in Volts). For
-
- the inductor, the (optional) initial condition is the initial
-
- (time-zero) value of inductor current (in Amps) that flows from
-
- N+, through the inductor, to N-. Note that the initial condi-
-
- tions (if any) apply 'only' if the UIC option is specified on the
-
- .TRAN card.
-
-
-
- 6.3. Coupled (Mutual) Inductors
-
- General form:
-
-
- KXXXXXXX LYYYYYYY LZZZZZZZ VALUE
-
-
-
-
-
-
-
-
-
-
-
-
-
-
- 12
-
-
- Examples:
-
-
- K43 LAA LBB 0.999
- KXFRMR L1 L2 0.87
-
-
-
- LYYYYYYY and LZZZZZZZ are the names of the two coupled
-
- inductors, and VALUE is the coefficient of coupling, K, which
-
- must be greater than 0 and less than or equal to 1. Using the
-
- 'dot' convention, place a 'dot' on the first node of each induc-
-
- tor.
-
-
-
- 6.4. Transmission Lines (Lossless)
-
-
- General form:
-
-
- TXXXXXXX N1 N2 N3 N4 Z0=VALUE <TD=VALUE> <F=FREQ <NL=NRMLEN>>
- + <IC=V1,I1,V2,I2>
-
-
- Examples:
-
-
- T1 1 0 2 0 Z0=50 TD=10NS
-
-
-
- N1 and N2 are the nodes at port 1; N3 and N4 are the nodes
-
- at port 2. Z0 is the characteristic impedance. The length of
-
- the line may be expressed in either of two forms. The transmis-
-
- sion delay, TD, may be specified directly (as TD=10ns, for exam-
-
- ple). Alternatively, a frequency F may be given, together with
-
- NL, the normalized electrical length of the transmission line
-
- with respect to the wavelength in the line at the frequency F.
-
-
-
-
-
-
-
-
-
-
-
-
-
- 13
-
-
- If a frequency is specified but NL is omitted, 0.25 is assumed
-
- (that is, the frequency is assumed to be the quarter-wave fre-
-
- quency). Note that although both forms for expressing the line
-
- length are indicated as optional, one of the two must be speci-
-
- fied.
-
-
- Note that this element models only one propagating mode. If
-
- all four nodes are distinct in the actual circuit, then two modes
-
- may be excited. To simulate such a situation, two transmission-
-
- line elements are required. (see the example in Appendix A for
-
- further clarification.)
-
-
- The (optional) initial condition specification consists of
-
- the voltage and current at each of the transmission line ports.
-
- Note that the initial conditions (if any) apply 'only' if the UIC
-
- option is specified on the .TRAN card.
-
-
-
- 6.5. Linear Dependent Sources
-
-
-
- SPICE allows circuits to contain linear dependent sources
-
- characterized by any of the four equations
-
-
- i=g*v v=e*v i=f*i v=h*i
-
-
- where g, e, f, and h are constants representing transconductance,
-
- voltage gain, current gain, and transresistance, respectively.
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
- 14
-
-
- 6.6. Linear Voltage-Controlled Current Sources
-
-
- General form:
-
-
- GXXXXXXX N+ N- NC+ NC- VALUE
-
-
- Examples:
-
-
- G1 2 0 5 0 0.1MMHO
-
-
-
- N+ and N- are the positive and negative nodes, respectively.
-
- Current flow is from the positive node, through the source, to
-
- the negative node. NC+ and NC- are the positive and negative
-
- controlling nodes, respectively. VALUE is the transconductance
-
- (in mhos).
-
-
-
- 6.7. Linear Voltage-Controlled Voltage Sources
-
- General form:
-
-
- EXXXXXXX N+ N- NC+ NC- VALUE
-
-
- Examples:
-
-
- E1 2 3 14 1 2.0
-
-
-
- N+ is the positive node, and N- is the negative node. NC+
-
- and NC- are the positive and negative controlling nodes, respec-
-
- tively. VALUE is the voltage gain.
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
- 15
-
-
- 6.8. Linear Current-Controlled Current Sources
-
-
- General form:
-
-
- FXXXXXXX N+ N- VNAM VALUE
-
-
- Examples:
-
-
- F1 13 5 VSENS 5
-
-
-
- N+ and N- are the positive and negative nodes, respectively.
-
- Current flow is from the positive node, through the source, to
-
- the negative node. VNAM is the name of a voltage source through
-
- which the controlling current flows. The direction of positive
-
- controlling current flow is from the positive node, through the
-
- source, to the negative node of VNAM. VALUE is the current gain.
-
-
-
- 6.9. Linear Current-Controlled Voltage Sources
-
- General form:
-
-
- HXXXXXXX N+ N- VNAM VALUE
-
-
- Examples:
-
-
- HX 5 17 VZ 0.5K
-
-
-
- N+ and N- are the positive and negative nodes, respectively.
-
- VNAM is the name of a voltage source through which the control-
-
- ling current flows. The direction of positive controlling
-
-
-
-
-
-
-
-
-
-
-
-
-
- 16
-
-
- current flow is from the positive node, through the source, to
-
- the negative node of VNAM. VALUE is the transresistance (in
-
- ohms).
-
-
-
- 6.10. Independent Sources
-
-
- General form:
-
-
- VXXXXXXX N+ N- <<DC> DC/TRAN VALUE> <AC <ACMAG <ACPHASE>>>
- IYYYYYYY N+ N- <<DC> DC/TRAN VALUE> <AC <ACMAG <ACPHASE>>>
-
-
- Examples:
-
-
- VCC 10 0 DC 6
- VIN 13 2 0.001 AC 1 SIN(0 1 1MEG)
- ISRC 23 21 AC 0.333 45.0 SFFM(0 1 10K 5 1K)
- VMEAS 12 9
-
-
-
- N+ and N- are the positive and negative nodes, respectively.
-
- Note that voltage sources need not be grounded. Positive current
-
- is assumed to flow from the positive node, through the source, to
-
- the negative node. A current source of positive value, will
-
- force current to flow out of the N+ node, through the source, and
-
- into the N- node. Voltage sources, in addition to being used for
-
- circuit excitation, are the 'ammeters' for SPICE, that is, zero
-
- valued voltage sources may be inserted into the circuit for the
-
- purpose of measuring current. They will, of course, have no
-
- effect on circuit operation since they represent short-circuits.
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
- 17
-
-
- DC/TRAN is the dc and transient analysis value of the
-
- source. If the source value is zero both for dc and transient
-
- analyses, this value may be omitted. If the source value is
-
- time-invariant (e.g., a power supply), then the value may option-
-
- ally be preceded by the letters DC.
-
-
-
- ACMAG is the ac magnitude and ACPHASE is the ac phase. The
-
- source is set to this value in the ac analysis. If ACMAG is
-
- omitted following the keyword AC, a value of unity is assumed.
-
- If ACPHASE is omitted, a value of zero is assumed. If the source
-
- is not an ac small-signal input, the keyword AC and the ac values
-
- are omitted.
-
-
-
- Any independent source can be assigned a time-dependent
-
- value for transient analysis. If a source is assigned a time-
-
- dependent value, the time-zero value is used for dc analysis.
-
- There are five independent source functions: pulse, exponential,
-
- sinusoidal, piece-wise linear, and single-frequency FM. If
-
- parameters other than source values are omitted or set to zero,
-
- the default values shown will be assumed. (TSTEP is the printing
-
- increment and TSTOP is the final time (see the .TRAN card for
-
- explanation)).
-
-
- 1. Pulse PULSE(V1 V2 TD TR TF PW PER)
-
-
- Examples:
-
-
-
-
-
-
-
-
-
-
-
-
-
-
- 18
-
-
- VIN 3 0 PULSE(-1 1 2NS 2NS 2NS 50NS 100NS)
-
-
-
- parameters default values units
-
- V1 (initial value) Volts or Amps
- V2 (pulsed value) Volts or Amps
- TD (delay time) 0.0 seconds
- TR (rise time) TSTEP seconds
- TF (fall time) TSTEP seconds
- PW (pulse width) TSTOP seconds
- PER(period) TSTOP seconds
-
-
-
- A single pulse so specified is described by the following
-
- table:
-
-
-
- time value
-
- 0 V1
- TD V1
- TD+TR V2
- TD+TR+PW V2
- TD+TR+PW+TF V1
- TSTOP V1
-
-
- Intermediate points are determined by linear interpolation.
-
-
- 2. Sinusoidal SIN(VO VA FREQ TD THETA)
-
- Examples:
-
-
- VIN 3 0 SIN(0 1 100MEG 1NS 1E10)
-
-
-
-
- parameters default value units
-
- VO (offset) Volts or Amps
- VA (amplitude) Volts or Amps
-
-
-
-
-
-
-
-
-
-
-
-
-
-
- 19
-
-
- FREQ (frequency) 1/TSTOP Hz
- TD (delay) 0.0 seconds
- THETA (damping factor) 0.0 1/seconds
-
-
-
- The shape of the waveform is described by the following
-
- table:
-
-
-
- time value
-
- 0 to TD VO
- TD to TSTOP VO + VA*exp(-(time-TD)*THETA)*sine(twopi*FREQ*(time+TD))
-
-
-
- 3. Exponential EXP(V1 V2 TD1 TAU1 TD2 TAU2)
-
-
- Examples:
-
-
- VIN 3 0 EXP(-4 -1 2NS 30NS 60NS 40NS)
-
-
-
- parameters default values units
- V1 (initial value) Volts or Amps
- V2 (pulsed value) Volts or Amps
- TD1 (rise delay time) 0.0 seconds
- TAU1 (rise time constant) TSTEP seconds
- TD2 (fall delay time) TD1+TSTEP seconds
- TAU2 (fall time constant) TSTEP seconds
-
-
-
- The shape of the waveform is described by the following
-
- table:
-
-
-
- time value
- 0 to TD1 V1
- TD1 to TD2 V1+(V2-V1)*(1-exp(-(time-TD1)/TAU1))
- TD2 to TSTOP V1+(V2-V1)*(1-exp(-(time-TD1)/TAU1))
-
-
-
-
-
-
-
-
-
-
-
-
-
-
- 20
-
-
- +(V1-V2)*(1-exp(-(time-TD2)/TAU2))
-
-
-
- 4. Piece-Wise Linear PWL(T1 V1 <T2 V2 T3 V3 T4 V4 ...>)
-
-
- Examples:
-
-
- VCLOCK 7 5 PWL(0 -7 10NS -7 11NS -3 17NS -3 18NS -7 50NS -7)
-
-
-
- Parameters and default values
-
-
-
- Each pair of values (Ti, Vi) specifies that the value of the source is Vi
- (in Volts or Amps) at time=Ti. The value of the source at intermediate values
- of time is determined by using linear interpolation on the input values.
-
-
-
- 5. Single-Frequency FM SFFM(VO VA FC MDI FS)
-
- Examples:
-
-
- V1 12 0 SFFM(0 1M 20K 5 1K)
-
-
-
-
- parameters default values units
-
- VO (offset) Volts or Amps
- VA (amplitude) Volts or Amps
- FC (carrier frequency) 1/TSTOP Hz
- MDI (modulation index)
- FS (signal frequency) 1/TSTOP Hz
-
-
-
- The shape of the waveform is described by the following
-
- equation:
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
- 21
-
-
- value = VO + VA*sine((twopi*FC*time) + MDI*sine(twopi*FS*time))
-
-
-
-
- 6.11. Switches
-
-
- General form:
-
-
- SXXXXXXX N+ N- NC+ NC- MODEL <ON><OFF>
- WYYYYYYY N+ N- VNAM MODEL <ON><OFF>
-
-
- Examples:
-
-
- s1 1 2 3 4 switch1 ON
- s2 5 6 3 0 sm2 off
- Switch1 1 2 10 0 smodel1
- w1 1 2 vclock switchmod1
- W2 3 0 vramp sm1 ON
- wreset 5 6 vclck lossyswitch OFF
-
-
-
- Nodes 1 and 2 are the nodes between which the switch termi-
-
- nals are connected. The model name is mandatory while the ini-
-
- tial conditions are optional. For the voltage controlled switch,
-
- nodes 3 and 4 are the positive and negative controlling nodes
-
- respectively. For the current controlled switch, the controlling
-
- current is that through the specified voltage source. The direc-
-
- tion of positive controlling current flow is from the positive
-
- node, through the source, to the negative node.
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
- 22
-
-
- 7. SEMICONDUCTOR DEVICES
-
-
-
- The elements described to this point typically require only
-
- a few parameter values. However, the models for the semiconduc-
-
- tor devices that are included in the SPICE program require many
-
- parameter values. Often, many devices in a circuit are defined
-
- by the same set of device model parameters. For these reasons, a
-
- set of device model parameters is defined on a separate .MODEL
-
- card and assigned a unique model name. The device element cards
-
- in SPICE then refer to the model name. This scheme alleviates
-
- the need to specify all of the model parameters on each device
-
- element card.
-
-
- Each device element card contains the device name, the nodes
-
- to which the device is connected, and the device model name. In
-
- addition, other optional parameters may be specified for some
-
- devices: geometric factors and an initial condition.
-
-
- The area factor used on the diode, BJT and JFET device cards
-
- determines the number of equivalent parallel devices of a speci-
-
- fied model. The affected parameters are marked with an asterisk
-
- under the heading 'area' in the model descriptions below.
-
- Several geometric factors associated with the channel and the
-
- drain and source diffusions can be specified on the MOSFET device
-
- card.
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
- 23
-
-
- Two different forms of initial conditions may be specified
-
- for some devices. The first form is included to improve the dc
-
- convergence for circuits that contain more than one stable state.
-
- If a device is specified OFF, the dc operating point is deter-
-
- mined with the terminal voltages for that device set to zero.
-
- After convergence is obtained, the program continues to iterate
-
- to obtain the exact value for the terminal voltages. If a cir-
-
- cuit has more than one dc stable state, the OFF option can be
-
- used to force the solution to correspond to a desired state. If
-
- a device is specified OFF when in reality the device is conduct-
-
- ing, the program will still obtain the correct solution (assuming
-
- the solutions converge) but more iterations will be required
-
- since the program must independently converge to two separate
-
- solutions. The .NODESET card serves a similar purpose as the OFF
-
- option. The .NODESET option is easier to apply and is the pre-
-
- ferred means to aid convergence.
-
-
- The second form of initial conditions are specified for use
-
- with the transient analysis. These are true 'initial conditions'
-
- as opposed to the convergence aids above. See the description of
-
- the .IC card and the .TRAN card for a detailed explanation of
-
- initial conditions.
-
-
-
- 7.1. Semiconductor Resistors
-
-
- General form:
-
-
-
-
-
-
-
-
-
-
-
-
-
-
- 24
-
-
- RXXXXXXX N1 N2 <VALUE> <MNAME> <L=LENGTH> <W=WIDTH>
-
-
- Examples:
-
-
- RLOAD 2 10 10K
- RMOD 3 7 RMODEL L=10u W=1u
-
-
-
- This is the more general form of the resistor presented in
-
- section 6.1, and allows the modeling of temperature effects and
-
- for the calculation of the actual resistance value from strictly
-
- geometric information and the specifications of the process. If
-
- VALUE is specified, it overrides the geometric information and
-
- defines the resistance. If MNAME is specified, then the resis-
-
- tance may be calculated from the process information in the model
-
- MNAME and the given LENGTH and WIDTH. If VALUE is not specified,
-
- then MNAME and LENGTH must be specified. If WIDTH is not speci-
-
- fied, then it will be taken from the default width given in the
-
- model.
-
-
-
- 7.2. Semiconductor Capacitors
-
-
- General form:
-
-
- CXXXXXXX N1 N2 <VALUE> <MNAME> <L=LENGTH> <W=WIDTH> <IC=VAL>
-
-
- Examples:
-
-
- CLOAD 2 10 10P
- CMOD 3 7 CMODEL L=10u W=1u
-
-
-
-
-
-
-
-
-
-
-
-
-
-
- 25
-
-
- This is the more general form of the Capacitor presented in
-
- section 6.2, and allows for the calculation of the actual capaci-
-
- tance value from strictly geometric information and the specifi-
-
- cations of the process. If VALUE is specified, it defines the
-
- capacitance. If MNAME is specified, then the capacitance is cal-
-
- culated from the process information in the model MNAME and the
-
- given LENGTH and WIDTH. If VALUE is not specified, then MNAME
-
- and LENGTH must be specified. If WIDTH is not specified, then it
-
- will be taken from the default width given in the model. Either
-
- VALUE or MNAME, LENGTH, and WIDTH may be specified, but not both
-
- sets.
-
-
-
- 7.3. Uniform Distributed RC Lines (Lossy)
-
-
- General form:
-
-
- UXXXXXXX N1 N2 N3 MNAME L=LEN <N=LUMPS>
-
-
- Examples:
-
-
- U1 1 2 0 URCMOD L=50U
- URC2 1 12 2 UMODL l=1MIL N=6
-
-
-
- N1 and N2 are the two element nodes the RC line connects,
-
- while N3 is the node to which the capacitances are connected.
-
- MNAME is the model name, LEN is the length of the RC line in
-
- meters. LUMPS, if specified, is the number of lumped segments to
-
- use in modeling the RC line (see the model description for the
-
-
-
-
-
-
-
-
-
-
-
-
-
- 26
-
-
- action taken if this parameter is omitted).
-
-
-
- 7.4. Junction Diodes
-
-
- General form:
-
-
- DXXXXXXX N+ N- MNAME <AREA> <OFF> <IC=VD>
-
-
- Examples:
-
-
- DBRIDGE 2 10 DIODE1
- DCLMP 3 7 DMOD 3.0 IC=0.2
-
-
-
- N+ and N- are the positive and negative nodes, respectively.
-
- MNAME is the model name, AREA is the area factor, and OFF indi-
-
- cates an (optional) starting condition on the device for dc
-
- analysis. If the area factor is omitted, a value of 1.0 is
-
- assumed. The (optional) initial condition specification using
-
- IC=VD is intended for use with the UIC option on the .TRAN card,
-
- when a transient analysis is desired starting from other than the
-
- quiescent operating point.
-
-
-
- 7.5. Bipolar Junction Transistors (BJT's)
-
- General form:
-
-
- QXXXXXXX NC NB NE <NS> MNAME <AREA> <OFF> <IC=VBE,VCE>
-
-
- Examples:
-
-
- Q23 10 24 13 QMOD IC=0.6,5.0
-
-
-
-
-
-
-
-
-
-
-
-
- 27
-
-
- Q50A 11 26 4 20 MOD1
-
-
-
- NC, NB, and NE are the collector, base, and emitter nodes,
-
- respectively. NS is the (optional) substrate node. If unspeci-
-
- fied, ground is used. MNAME is the model name, AREA is the area
-
- factor, and OFF indicates an (optional) initial condition on the
-
- device for the dc analysis. If the area factor is omitted, a
-
- value of 1.0 is assumed. The (optional) initial condition
-
- specification using IC=VBE,VCE is intended for use with the UIC
-
- option on the .TRAN card, when a transient analysis is desired
-
- starting from other than the quiescent operating point. See the
-
- .IC card description for a better way to set transient initial
-
- conditions.
-
-
-
- 7.6. Junction Field-Effect Transistors (JFET's)
-
-
- General form:
-
-
- JXXXXXXX ND NG NS MNAME <AREA> <OFF> <IC=VDS,VGS>
-
-
- Examples:
-
-
- J1 7 2 3 JM1 OFF
-
-
-
- ND, NG, and NS are the drain, gate, and source nodes,
-
- respectively. MNAME is the model name, AREA is the area factor,
-
- and OFF indicates an (optional) initial condition on the device
-
- for dc analysis. If the area factor is omitted, a value of 1.0
-
-
-
-
-
-
-
-
-
-
-
-
- 28
-
-
- is assumed. The (optional) initial condition specification,
-
- using IC=VDS,VGS is intended for use with the UIC option on the
-
- .TRAN card, when a transient analysis is desired starting from
-
- other than the quiescent operating point. See the .IC card for a
-
- better way to set initial conditions.
-
-
-
- 7.7. MOSFET's
-
-
- General form:
-
-
- MXXXXXXX ND NG NS NB MNAME <L=VAL> <W=VAL> <AD=VAL> <AS=VAL>
- + <PD=VAL> <PS=VAL> <NRD=VAL> <NRS=VAL> <OFF> <IC=VDS,VGS,VBS>
-
-
- Examples:
-
-
- M1 24 2 0 20 TYPE1
- M31 2 17 6 10 MODM L=5U W=2U
- M1 2 9 3 0 MOD1 L=10U W=5U AD=100P AS=100P PD=40U PS=40U
-
-
- ND, NG, NS, and NB are the drain, gate, source, and bulk (sub-
-
- strate) nodes, respectively. MNAME is the model name. L and W
-
- are the channel length and width, in meters. AD and AS are the
-
- areas of the drain and source diffusions, in sq-meters. Note
-
- that the suffix U specifies microns (1E-6 m) and P sq-microns
-
- (1E-12 sq-m). If any of L, W, AD, or AS are not specified,
-
- default values are used. The use of defaults simplifies input
-
- deck preparation, as well as the editing required if device
-
- geometries are to be changed. PD and PS are the perimeters of
-
- the drain and source junctions, in meters. NRD and NRS designate
-
- the equivalent number of squares of the drain and source
-
-
-
-
-
-
-
-
-
-
-
-
- 29
-
-
- diffusions; these values multiply the sheet resistance RSH speci-
-
- fied on the .MODEL card for an accurate representation of the
-
- parasitic series drain and source resistance of each transistor.
-
- PD and PS default to 0.0 while NRD and NRS to 1.0. OFF indicates
-
- an (optional) initial condition on the device for dc analysis.
-
- The (optional) initial condition specification using
-
- IC=VDS,VGS,VBS is intended for use with the UIC option on the
-
- .TRAN card, when a transient analysis is desired starting from
-
- other than the quiescent operating point. See the .IC card for a
-
- better and more convenient way to specify transient initial con-
-
- ditions.
-
-
-
- 7.8. .MODEL Card
-
-
- General form:
-
-
- .MODEL MNAME TYPE(PNAME1=PVAL1 PNAME2=PVAL2 ... )
-
-
- Examples:
-
-
- .MODEL MOD1 NPN (BF=50 IS=1E-13 VBF=50)
-
-
-
- The .MODEL card specifies a set of model parameters that
-
- will be used by one or more devices. MNAME is the model name,
-
- and type is one of the following ten types:
-
-
- R resistor model
- C capacitor model
-
-
-
-
-
-
-
-
-
-
-
-
-
-
- 30
-
-
- URC Uniform Distributed RC model
- D diode model
- NPN NPN BJT model
- PNP PNP BJT model
- NJF N-channel JFET model
- PJF P-channel JFET model
- NMOS N-channel MOSFET model
- PMOS P-channel MOSFET model
- SW voltage controlled switch
- CSW current controlled switch
-
-
-
- Parameter values are defined by appending the parameter
-
- name, as given below for each model type, followed by an equal
-
- sign and the parameter value. Model parameters that are not
-
- given a value are assigned the default values given below for
-
- each model type.
-
-
-
- 7.9. Resistor Model
-
-
-
- The resistor model consists of process-related device data
-
- that allow the resistance to be calculated from geometric infor-
-
- mation and to be corrected for temperature. The parameters
-
- available are:
-
-
- name parameter units default example
- o
- TC1 first order temperature coeff. Z/oC2 0.0 -
- TC2 second order temperature coeff. Z/ C 0.0 -
- RSH sheet resistance Z/[] - 50
- DEFW default width meters 1e-6 2e-6
- NARROW narrowing due to side etching meters 0.0 1e-7
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
- 31
-
-
- The sheet resistance is used with the narrowing parameter
-
- and L and W from the resistor card to determine the nominal
-
- resistance by the formula
-
-
- L-NARROW
- R=RSHx
- W-NARROW
- Defw is used to supply a default value for W if one is not speci-
-
- fied on the device card. If either RSH or L is not specified,
-
- then the standard default resistance value of 1k Z is used.
-
- After the nominal resistance is calculated, it is adjusted for
-
- temperature by the formula:
-
-
- RES(temp)=RES(tnom)x(1+TC1x(temp-tnom)+TC2*(temp-tnom)2)
-
-
-
- 7.10. Capacitor Model
-
-
-
- The capacitor model contains process information that may be
-
- used to compute the capacitance from strictly geometric informa-
-
- tion.
-
-
-
- name parameter units default example
- 2
- CJ junction bottom capacitance F/meters - 5e-5
- CJSW junction sidewall capacitance F/meters - 2e-11
- DEFW default device width meters 1e-6 2e-6
- NARROW narrowing due to side etching meters 0.0 1e-7
-
-
-
- The capacitor has a capacitance computed as
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
- 32
-
-
- CAP=CJx(LENGTH-NARROW)x(WIDTH-NARROW)+2xCJSWx(LENGTH+WIDTH-2*NARROW)
-
-
-
- 7.11. Uniform Distributed RC Model
-
-
-
- The URC model is derived from a model proposed by L.
-
- Gertzberrg in 1974. The model is accomplished by a subcircuit
-
- type expansion of the URC line into a network of lumped RC seg-
-
- ments with internally generated nodes. The RC segments are in a
-
- geometric progression, increasing toward the middle of the URC
-
- line, with K as a proportionality constant. The number of lumped
-
- segments used, if not specified on the URC line card, is deter-
-
- mined by the following formula:
-
- 2
- | R C 2 |(K-1)| |
- log|Fmaxx x x2xJxl x| | |
- | L L | K | |
- N= _____________________________
- logK
-
-
- The URC line will be made up strictly of resistor and capa-
-
- citor segments unless the ISPERL parameter is given a non-zero
-
- value, in which case the capacitors are replaced with reverse
-
- biased diodes with a zero-bias junction capacitance equivalent to
-
- the capacitance replaced, and with a saturation current of ISPERL
-
- amps per meter of transmission line and an optional series resis-
-
- tance equivalent to RSPERL ohms per meter.
-
-
- name parameter units default example area
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
- 33
-
-
- 1 K Propagation Constant - 2.0 1.2 -
- 2 FMAX Maximum Frequency of interest Hz 1.0G 6.5MEG -
- 3 RPERL Resistance per unit length Ohm/m 1000 10 -
- 4 CPERL Capacitance per unit length F/m 1.0E-15 1PF -
- 5 ISPERL Saturation Current per unit length Amp/m 0 - -
- 6 RSPERL Diode Resistance per unit length Ohm/m 0 - -
-
-
-
-
- 7.12. Switch Model
-
-
-
- The switch model allows an almost ideal switch to be
-
- described in SPICE. The switch is not quite ideal, in that the
-
- resistance can not change from 0 to infinity, but must always
-
- have a finite positive value. By proper selection of the on and
-
- off resistances, they can be effectively zero and infinity in
-
- comparison to other circuit elements. The parameters available
-
- are:
-
-
- name parameter units default switch
-
- VT threshold voltage Volts 0.0 S
- IT threshold current Amps 0.0 W
- VH hysteresis voltage Volts 0.0 S
- IH hysteresis current Amps 0.0 W
- RON on resistance Z 1.0 both
- ROFF off resistance Z 1/GMIN* both
-
-
-
- *(See the .OPTIONS card for a description of GMIN, its
-
- default value results is a off resistance of 1.0e+12 ohms.)
-
-
-
- The use of an ideal element that is highly non-linear such
-
- as a switch can cause large discontinuities to occur in the cir-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
- 34
-
-
- cuit node voltages. A rapid change such as that associated with
-
- a switch changing state can cause numerical roundoff or tolerance
-
- problems leading to erroneous results or timestep difficulties.
-
- The user of switches can improve the situation by taking the fol-
-
- lowing steps:
-
-
- First of all it is wise to set ideal switch impedences only
-
- high and low enough to be negligible with respect to other cir-
-
- cuit elements. Using switch impedences that are close to "ideal"
-
- in all cases will aggravate the problem of discontinuities men-
-
- tioned above. Of cource, when modeling real devices such as MOS-
-
- FETS, the on resistance should be adjusted to a realistic level
-
- depending on the size of the device being modelled.
-
-
- If a wide rango of ON to OFF resistance must be used in the
-
- switched (ROFF/RON >1e+12), then the tolerance on errors allowed
-
- during transient analysis should be decreased by using the
-
- .OPTIONS card and specifying TRTOL to be less than the default
-
- value of 7.0. When switches are placed around capacitors, then
-
- the option CHGTOL should also be reduced. Suggested values for
-
- these two options are 1.0 and 1e-16 respectively. These changes
-
- inform SPICE3 to be more careful around the switch points so that
-
- no errors are made due to the rapid change in the circuit.
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
- 35
-
-
- 7.13. Diode Model
-
-
-
- The dc characteristics of the diode are determined by the
-
- parameters IS and N. An ohmic resistance, RS, is included.
-
- Charge storage effects are modeled by a transit time, TT, and a
-
- nonlinear depletion layer capacitance which is determined by the
-
- parameters CJO, VJ, and M. The temperature dependence of the
-
- saturation current is defined by the parameters EG, the energy
-
- and XTI, the saturation current temperature exponent. Reverse
-
- breakdown is modeled by an exponential increase in the reverse
-
- diode current and is determined by the parameters BV and IBV
-
- (both of which are positive numbers).
-
-
- name parameter units default example area
-
- 1 IS saturation current A 1.0E-14 1.0E-14 *
- 2 RS ohmic resistance Ohm 0 10 *
- 3 N emission coefficient - 1 1.0
- 4 TT transit-time sec 0 0.1Ns
- 5 CJO zero-bias junction capacitance F 0 2PF *
- 6 VJ junction potential V 1 0.6
- 7 M grading coefficient - 0.5 0.5
- 8 EG activation energy eV 1.11 1.11 Si
- 0.69 Sbd
- 0.67 Ge
- 9 XTI saturation-current temp. exp - 3.0 3.0 jn
- 2.0 Sbd
- 10 KF flicker noise coefficient - 0
- 11 AF flicker noise exponent - 1
- 12 FC coefficient for forward-bias - 0.5
- depletion capacitance formula
- 13 BV reverse breakdown voltage V infinite 40.0
- 14 IBV current at breakdown voltage A 1.0E-3
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
- 36
-
-
- 7.14. BJT Models (both NPN and PNP)
-
-
-
- The bipolar junction transistor model in SPICE is an adapta-
-
- tion of the integral charge control model of Gummel and Poon.
-
- This modified Gummel-Poon model extends the original model to
-
- include several effects at high bias levels. The model will
-
- automatically simplify to the simpler Ebers-Moll model when cer-
-
- tain parameters are not specified. The parameter names used in
-
- the modified Gummel-Poon model have been chosen to be more easily
-
- understood by the program user, and to reflect better both physi-
-
- cal and circuit design thinking.
-
-
- The dc model is defined by the parameters IS, BF, NF, ISE,
-
- IKF, and NE which determine the forward current gain characteris-
-
- tics, IS, BR, NR, ISC, IKR, and NC which determine the reverse
-
- current gain characteristics, and VAF and VAR which determine the
-
- output conductance for forward and reverse regions. Three ohmic
-
- resistances RB, RC, and RE are included, where RB can be high
-
- current dependent. Base charge storage is modeled by forward and
-
- reverse transit times, TF and TR, the forward transit time TF
-
- being bias dependent if desired, and nonlinear depletion layer
-
- capacitances which are determined by CJE, VJE, and MJE for the
-
- B-E junction , CJC, VJC, and MJC for the B-C junction and CJS,
-
- VJS, and MJS for the C-S (Collector-Substrate) junction. The
-
- temperature dependence of the saturation current, IS, is deter-
-
- mined by the energy-gap, EG, and the saturation current tempera-
-
-
-
-
-
-
-
-
-
-
-
-
-
- 37
-
-
- ture exponent, XTI. Additionally base current temperature depen-
-
- dence is modeled by the beta temperature exponent XTB in the new
-
- model.
-
-
- The BJT parameters used in the modified Gummel-Poon model
-
- are listed below. The parameter names used in earlier versions of
-
- SPICE2 are still accepted.
-
-
- Modified Gummel-Poon BJT Parameters.
-
-
-
- name parameter units default example area
-
- 1 IS transport saturation current A 1.0E-16 1.0E-15 *
- 2 BF ideal maximum forward beta - 100 100
- 3 NF forward current emission coefficient - 1.0 1
- 4 VAF forward Early voltage V infinite 200
- 5 IKF corner for forward beta
- high current roll-off A infinite 0.01 *
- 6 ISE B-E leakage saturation current A 0 1.0E-13 *
- 7 NE B-E leakage emission coefficient - 1.5 2
- 8 BR ideal maximum reverse beta - 1 0.1
- 9 NR reverse current emission coefficient - 1 1
- 10 VAR reverse Early voltage V infinite 200
- 11 IKR corner for reverse beta
- high current roll-off A infinite 0.01 *
- 12 ISC B-C leakage saturation current A 0 1.0E-13 *
- 13 NC B-C leakage emission coefficient - 2 1.5
- 14 RB zero bias base resistance Ohms 0 100 *
- 15 IRB current where base resistance
- falls halfway to its min value A infinite 0.1 *
- 16 RBM minimum base resistance
- at high currents Ohms RB 10 *
- 17 RE emitter resistance Ohms 0 1 *
- 18 RC collector resistance Ohms 0 10 *
- 19 CJE B-E zero-bias depletion capacitance F 0 2PF *
- 20 VJE B-E built-in potential V 0.75 0.6
- 21 MJE B-E junction exponential factor - 0.33 0.33
- 22 TF ideal forward transit time sec 0 0.1Ns
- 23 XTF coefficient for bias dependence of TF - 0
- 24 VTF voltage describing VBC
- dependence of TF V infinite
-
-
-
-
-
-
-
-
-
-
-
-
-
-
- 38
-
-
- 25 ITF high-current parameter
- for effect on TF A 0 *
- 26 PTF excess phase at freq=1.0/(TF*2PI) Hz deg 0
- 27 CJC B-C zero-bias depletion capacitance F 0 2PF *
- 28 VJC B-C built-in potential V 0.75 0.5
- 29 MJC B-C junction exponential factor - 0.33 0.5
- 30 XCJC fraction of B-C depletion capacitance - 1
- connected to internal base node
- 31 TR ideal reverse transit time sec 0 10Ns
- 32 CJS zero-bias collector-substrate
- capacitance F 0 2PF *
- 33 VJS substrate junction built-in potential V 0.75
- 34 MJS substrate junction exponential factor - 0 0.5
- 35 XTB forward and reverse beta
- temperature exponent - 0
- 36 EG energy gap for temperature
- effect on IS eV 1.11
- 37 XTI temperature exponent for effect on IS - 3
- 38 KF flicker-noise coefficient - 0
- 39 AF flicker-noise exponent - 1
- 40 FC coefficient for forward-bias
- depletion capacitance formula - 0.5
-
-
-
-
- 7.15. JFET Models (both N and P Channel)
-
-
-
- The JFET model is derived from the FET model of Shichman and
-
- Hodges. The dc characteristics are defined by the parameters VTO
-
- and BETA, which determine the variation of drain current with
-
- gate voltage, LAMBDA, which determines the output conductance,
-
- and IS, the saturation current of the two gate junctions. Two
-
- ohmic resistances, RD and RS, are included. Charge storage is
-
- modeled by nonlinear depletion layer capacitances for both gate
-
- junctions which vary as the -1/2 power of junction voltage and
-
- are defined by the parameters CGS, CGD, and PB.
-
-
- name parameter units default example area
-
- 1 VTO threshold voltage V -2.0 -2.0
- 2 BETA transconductance parameter A/V**2 1.0E-4 1.0E-3 *
- 3 LAMBDA channel length modulation
- parameter 1/V 0 1.0E-4
- 4 RD drain ohmic resistance Ohm 0 100 *
- 5 RS source ohmic resistance Ohm 0 100 *
-
-
-
-
-
-
- 39
-
-
- 6 CGS zero-bias G-S junction capacitance F 0 5PF *
- 7 CGD zero-bias G-D junction capacitance F 0 1PF *
- 8 PB gate junction potential V 1 0.6
- 9 IS gate junction saturation current A 1.0E-14 1.0E-14 *
- 10 KF flicker noise coefficient - 0
- 11 AF flicker noise exponent - 1
- 12 FC coefficient for forward-bias - 0.5
- depletion capacitance formula
-
-
-
-
- 7.16. MOSFET Models (both N and P channel)
-
-
- SPICE provides four MOSFET device models, which differ in
-
- the formulation of the I-V characteristic. The variable LEVEL
-
- specifies the model to be used:
-
-
-
- LEVEL=1 -> Shichman-Hodges
- LEVEL=2 -> MOS2 (as described in [1])
- LEVEL=3 -> MOS3, a semi-empirical model(see [1])
- LEVEL=4 -> BSIM (as described in [2])
-
-
- The dc characteristics of the level 1 through level 3 MOSFETs are
-
- defined by the device parameters VTO, KP, LAMBDA, PHI and GAMMA.
-
- These parameters are computed by SPICE if process parameters
-
- (NSUB, TOX, ...) are given, but user-specified values always
-
- override. VTO is positive (negative) for enhancement mode and
-
- negative (positive) for depletion mode N-channel (P-channel) dev-
-
- ices. Charge storage is modeled by three constant capacitors,
-
- CGSO, CGDO, and CGBO which represent overlap capacitances, by the
-
- nonlinear thin-oxide capacitance which is distributed among the
-
- gate, source, drain, and bulk regions, and by the nonlinear
-
- depletion-layer capacitances for both substrate junctions divided
-
-
-
-
-
-
-
-
-
-
-
-
-
- 40
-
-
- into bottom and periphery, which vary as the MJ and MJSW power of
-
- junction voltage respectively, and are determined by the parame-
-
- ters CBD, CBS, CJ, CJSW, MJ, MJSW and PB. Charge storage effects
-
- are modeled by the piecewise linear voltags-dependent capacitance
-
- model proposed by Meyer. The thin-oxide charge storage effects
-
- are treated slightly different for the LEVEL=1 model. These
-
- voltage-dependent capacitances are included only if TOX is speci-
-
- fied in the input description and they are represented using
-
- Meyer's formulation.
-
-
- There is some overlap among the parameters describing the
-
- junctions, e.g. the reverse current can be input either as IS (in
-
- A) or as JS (in A/m**2). Whereas the first is an absolute value
-
- the second is multiplied by AD and AS to give the reverse current
-
- of the drain and source junctions respectively. This methodology
-
- has been chosen since there is no sense in relating always junc-
-
- tion characteristics with AD and AS entered on the device card;
-
- the areas can be defaulted. The same idea applies also to the
-
- zero-bias junction capacitances CBD and CBS (in F) on one hand,
-
- and CJ (in F/m**2) on the other. The parasitic drain and source
-
- series resistance can be expressed as either RD and RS (in ohms)
-
- or RSH (in ohms/sq.), the latter being multiplied by the number
-
- of squares NRD and NRS input on the device card.
-
-
- SPICE level 1 to level 3 parameters.
-
-
-
- name parameter units default example
-
- 1 LEVEL model index - 1
- 2 VTO zero-bias threshold voltage V 0.0 1.0
- 3 KP transconductance parameter A/V**2 2.0E-5 3.1E-5
- 4 GAMMA bulk threshold parameter V**0.5 0.0 0.37
- 5 PHI surface potential V 0.6 0.65
-
-
-
-
-
-
- 41
-
-
- 6 LAMBDA channel-length modulation
- (MOS1 and MOS2 only) 1/V 0.0 0.02
- 7 RD drain ohmic resistance Ohm 0.0 1.0
- 8 RS source ohmic resistance Ohm 0.0 1.0
- 9 CBD zero-bias B-D junction capacitance F 0.0 20FF
- 10 CBS zero-bias B-S junction capacitance F 0.0 20FF
- 11 IS bulk junction saturation current A 1.0E-14 1.0E-15
- 12 PB bulk junction potential V 0.8 0.87
- 13 CGSO gate-source overlap capacitance
- per meter channel width F/m 0.0 4.0E-11
- 14 CGDO gate-drain overlap capacitance
- per meter channel width F/m 0.0 4.0E-11
- 15 CGBO gate-bulk overlap capacitance
- per meter channel length F/m 0.0 2.0E-10
- 16 RSH drain and source diffusion
- sheet resistance Ohm/sq. 0.0 10.0
- 17 CJ zero-bias bulk junction bottom cap.
- per sq-meter of junction area F/m**2 0.0 2.0E-4
- 18 MJ bulk junction bottom grading coef. - 0.5 0.5
- 19 CJSW zero-bias bulk junction sidewall cap.
- per meter of junction perimeter F/m 0.0 1.0E-9
- 20 MJSW bulk junction sidewall grading coef. - 0.50(level1)
- 0.33(level2,3)
- 21 JS bulk junction saturation current
- per sq-meter of junction area A/m**2 1.0E-8
- 22 TOX oxide thickness meter 1.0E-7 1.0E-7
- 23 NSUB substrate doping 1/cm**3 0.0 4.0E15
- 24 NSS surface state density 1/cm**2 0.0 1.0E10
- 25 NFS fast surface state density 1/cm**2 0.0 1.0E10
- 26 TPG type of gate material: - 1.0
- +1 opp. to substrate
- -1 same as substrate
- 0 Al gate
- 27 XJ metallurgical junction depth meter 0.0 1U
- 28 LD lateral diffusion meter 0.0 0.8U
- 29 UO surface mobility cm**2/V-s 600 700
- 30 UCRIT critical field for mobility
- degradation (MOS2 only) V/cm 1.0E4 1.0E4
- 31 UEXP critical field exponent in
- mobility degradation (MOS2 only) - 0.0 0.1
- 32 UTRA transverse field coef (mobility)
- (deleted for MOS2) - 0.0 0.3
- 33 VMAX maximum drift velocity of carriers m/s 0.0 5.0E4
- 34 NEFF total channel charge (fixed and
- mobile) coefficient (MOS2 only) - 1.0 5.0
- 35 KF flicker noise coefficient - 0.0 1.0E-26
- 36 AF flicker noise exponent - 1.0 1.2
- 37 FC coefficient for forward-bias
- depletion capacitance formula - 0.5
- 38 DELTA width effect on threshold voltage
- (MOS2 and MOS3) - 0.0 1.0
-
-
-
-
-
-
-
-
-
-
-
-
- 42
-
-
- 39 THETA mobility modulation (MOS3 only) 1/V 0.0 0.1
- 40 ETA static feedback (MOS3 only) - 0.0 1.0
- 41 KAPPA saturation field factor (MOS3 only) - 0.2 0.5
-
-
-
-
- The level 4 parameters are all values obtained from process
-
- characterization, and can be generated automatically. J. Pierret
-
- [3] describes a means of generating a 'process' file, and the
-
- program Proc2Mod provided with SPICE3 will convert this file into
-
- a sequence of .MODEL cards suitable for inclusion in a SPICE
-
- deck. Parameters marked below with an * in the l/w column also
-
- have corresponding parameters with a length and width dependency.
-
- For example, VFB is the basic parameter with units of Volts, and
-
- LVFB and WVFB also exist and have units of Volt-Mmeter The for-
-
- mula
-
-
- P P
- P=P +_____L____+_____W____
- 0 L W
- effective effective
- is used to evaluate the parameter for the actual device specified
-
- with
-
-
- L =L -DL
- effective input
- and
-
-
- W =W -DW
- effective input
-
- Note that unlike the other models in SPICE, the BSIM model
-
- is designed for use with a process characterization system that
-
- provides all the parameters, thus there are no defaults for the
-
-
-
-
-
-
-
-
-
-
-
-
-
- 43
-
-
- parameters, and leaving one out is considered an error. For an
-
- example set of parameters and the format of a process file, see
-
- the SPICE2 implementation notes[2].
-
-
- SPICE BSIM (level 4) parameters.
-
-
-
- name parameter units l/w
-
- VFB flat-band voltage V *
- PHI surface inversion potential V *
- K1 body effect coefficient V1/2 *
- K2 drain/source depletion charge sharing coefficient - *
- ETA zero-bias drain-induced barrier lowering coefficient - *
- MUZ zero-bias mobility cm2/V-s
- DL shortening of channel Mm
- DW narrowing of channel Mm
- U0 zero-bias transverse-field mobility degradation coefficient V-1 *
- U1 zero-bias velocity saturation coefficient Mm/V *
- X2MZ sens. of mobility to substrate bias at v =0 cm2/V2-s *
- X2E sens. of drain-induced barrier lowering dsfect to substrate bias V-1 *
- X3E sens. of drain-induced barrier lowering effect to drain bias at V =V V-1 *
- X2U0 sens. of transverse field mobility degradation effect to substratdsbidd V-2 *
- X2U1 sens. of velocity saturation effect to substrate bias MmV-2 *
- MUS mobility at zero substrate bias and at V =V cm2/V2-s
- X2MS sens. of mobility to substrate bias at Vds=Vdd cm2/V2-s *
- X3MS sens. of mobility to drain bias at V =Vds dd cm2/V2-s *
- X3U1 sens. of velocity saturation effect ds dddin bias at V =V MmV-2 *
- TOX gate oxide thickness ds dd Mm
- TEMP temperature at which parameters were measured oC
- VDD measurement bias range V
- CGDO gate-drain overlap capacitance per meter channel width F/m
- CGSO gate-source overlap capacitance per meter channel width F/m
- CGBO gate-bulk overlap capacitance per meter channel length F/m
- XPART gate-oxide capacitance charge model flag -
- N0 zero-bias subthreshold slope coefficient - *
- NB sens. of subthreshold slope to substrate bias - *
- ND sens. of subthreshold slope to drain bias - *
-
-
-
-
- XPART = 0 selects a 40/60 drain/source charge partition in
-
- saturation, while XPART=1 selects a 0/100 drain/source charge
-
-
-
-
-
-
-
-
-
-
-
-
-
-
- 44
-
-
- partition. XPART=1 is recommended.
-
-
- [1] A. Vladimirescu and S. Liu, "The Simulation of MOS Integrated
-
- Circuits Using SPICE2", ERL Memo No. ERL M80/7, Electronics
-
- Research Laboratory, University of California, Berkeley, Oct.
-
- 1980.
-
- [2] B. J. Sheu, D. L. Scharfetter, and P. K. Ko, "SPICE2 Imple-
-
- mentation of BSIM" ERL Memo No. ERL M85/42, Electronics Research
-
- Laboratory, University of California, Berkeley, May 1985.
-
- [3] J. R. Pierret, "A MOS Parameter Extraction Program for the
-
- BSIM Model" ERL Memo Nos. ERL M84/99 and M84/100, Electronics
-
- Research Laboratory, University of California, Berkeley, Nov.
-
- 1984.
-
-
-
-
- 8. SUBCIRCUITS
-
-
-
- A subcircuit that consists of SPICE elements can be defined
-
- and referenced in a fashion similar to device models. The sub-
-
- circuit is defined in the input deck by a grouping of element
-
- cards; the program then automatically inserts the group of ele-
-
- ments wherever the subcircuit is referenced. There is no limit
-
- on the size or complexity of subcircuits, and subcircuits may
-
- contain other subcircuits. An example of subcircuit usage is
-
- given in Appendix A.
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
- 45
-
-
- 8.1. .SUBCKT Card
-
-
- General form:
-
-
-
-
- Examples:
-
-
-
-
-
- A circuit definition is begun with a .SUBCKT card. SUBNAM
-
- is the subcircuit name, and N1, N2, ... are the external nodes,
-
- which cannot be zero. The group of element cards which immedi-
-
- ately follow the .SUBCKT card define the subcircuit. The last
-
- card in a subcircuit definition is the .ENDS card (see below).
-
- Control cards may not appear within a subcircuit definition;
-
- however, subcircuit definitions may contain anything else,
-
- including other subcircuit definitions, device models, and sub-
-
- circuit calls (see below). Note that any device models or sub-
-
- circuit definitions included as part of a subcircuit definition
-
- are strictly local (i.e., such models and definitions are not
-
- known outside the subcircuit definition). Also, any element
-
- nodes not included on the .SUBCKT card are strictly local, with
-
- the exception of 0 (ground) which is always global.
-
-
-
- 8.2. .ENDS Card
-
- General form:
-
-
- .ENDS <SUBNAM>
-
-
-
-
-
-
-
-
-
-
-
-
-
- 46
-
-
- Examples:
-
-
- .ENDS OPAMP
-
-
-
- This card must be the last one for any subcircuit defini-
-
- tion. The subcircuit name, if included, indicates which subcir-
-
- cuit definition is being terminated; if omitted, all subcircuits
-
- being defined are terminated. The name is needed only when
-
- nested subcircuit definitions are being made.
-
-
-
- 8.3. Subcircuit Calls
-
-
- General form:
-
-
- XYYYYYYY N1 <N2 N3 ...> SUBNAM
-
-
- Examples:
-
-
- X1 2 4 17 3 1 MULTI
-
-
-
- Subcircuits are used in SPICE by specifying pseudo-elements
-
- beginning with the letter X, followed by the circuit nodes to be
-
- used in expanding the subcircuit.
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
- 47
-
-
- 9. CONTROL CARDS
-
-
-
- 9.1. .OPTIONS Card
-
-
- General form:
-
-
- .OPTIONS OPT1 OPT2 ... (or OPT=OPTVAL ...)
-
-
- Examples:
-
-
- .OPTIONS RELTOL=.005 TRTOL=8
-
-
-
- This card allows the user to reset program control and user
-
- options for specific simulation purposes. Any combination of the
-
- following options may be included, in any order. 'x' (below)
-
- represents some positive number.
-
-
- option effect
-
- GMIN=x resets the value of GMIN, the minimum conductance
- allowed by the program. The default value is 1.0E-12.
- RELTOL=x resets the relative error tolerance of the program. The
- default value is 0.001 (0.1 percent).
- ABSTOL=x resets the absolute current error tolerance of the
- program. The default value is 1 picoamp.
- VNTOL=x resets the absolute voltage error tolerance of the
- program. The default value is 1 microvolt.
- TRTOL=x resets the transient error tolerance. The default value
- is 7.0. This parameter is an estimate of the factor by
- which SPICE overestimates the actual truncation error.
- CHGTOL=x resets the charge tolerance of the program. The default
- value is 1.0E-14.
- PIVTOL=x resets the absolute minimum value for a matrix entry
- to be accepted as a pivot. The default value is 1.0E-13.
- PIVREL=x resets the relative ratio between the largest column entry
- and an acceptable pivot value. The default value is 1.0E-3.
- In the numerical pivoting algorithm the allowed minimum
-
-
-
-
-
-
-
-
-
-
-
-
-
-
- 48
-
-
- pivot value is determined by
- EPSREL=AMAX1(PIVREL*MAXVAL,PIVTOL)
- where MAXVAL is the maximum element in the column where
- a pivot is sought (partial pivoting).
- TNOM=x resets the nominal temperature. The default value is
- 27 deg C (300 deg K).
- ITL1=x resets the dc iteration limit. The default is 100.
- ITL2=x resets the dc transfer curve iteration limit. The
- default is 50.
- ITL5=x resets the transient analysis total iteration limit.
- the default is 5000. Set ITL5=0 to omit this test.
- DEFL=x resets the value for MOS channel length; the default
- is 100.0 micrometer.
- DEFW=x resets the value for MOS channel width; the default
- is 100.0 micrometer.
- DEFAD=x resets the value for MOS drain diffusion area; the
- default is 0.0.
- DEFAS=x resets the value for MOS source diffusion area; the
- default is 0.0.
-
-
-
-
- 9.2. .OP Card
-
-
- General form:
-
-
- .OP
-
-
-
-
- The inclusion of this card in an input deck will force SPICE
-
- to determine the dc operating point of the circuit with inductors
-
- shorted and capacitors opened. Note: a dc analysis is automati-
-
- cally performed prior to a transient analysis to determine the
-
- transient initial conditions, and prior to an ac small-signal
-
- analysis to determine the linearized, small-signal models for
-
- nonlinear devices.
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
- 49
-
-
- SPICE performs a dc operating point analysis if no other
-
- analyses are requested.
-
-
-
- 9.3. .DC Card
-
-
- General form:
-
-
- .DC SRCNAM VSTART VSTOP VINCR [SRC2 START2 STOP2 INCR2]
-
-
- Examples:
-
-
- .DC VIN 0.25 5.0 0.25
- .DC VDS 0 10 .5 VGS 0 5 1
- .DC VCE 0 10 .25 IB 0 10U 1U
-
-
-
- This card defines the dc transfer curve source and sweep
-
- limits. SRCNAM is the name of an independent voltage or current
-
- source. VSTART, VSTOP, and VINCR are the starting, final, and
-
- incrementing values respectively. The first example will cause
-
- the value of the voltage source VIN to be swept from 0.25 Volts
-
- to 5.0 Volts in increments of 0.25 Volts. A second source (SRC2)
-
- may optionally be specified with associated sweep parameters. In
-
- this case, the first source will be swept over its range for each
-
- value of the second source. This option can be useful for
-
- obtaining semiconductor device output characteristics. See the
-
- second example data deck in that section of the guide.
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
- 50
-
-
- 9.4. .NODESET Card
-
-
- General form:
-
-
- .NODESET V(NODNUM)=VAL V(NODNUM)=VAL ...
-
-
- Examples:
-
-
- .NODESET V(12)=4.5 V(4)=2.23
-
-
-
- This card helps the program find the dc or initial transient
-
- solution by making a preliminary pass with the specified nodes
-
- held to the given voltages. The restriction is then released and
-
- the iteration continues to the true solution. The .NODESET card
-
- may be necessary for convergence on bistable or astable circuits.
-
- In general, this card should not be necessary.
-
-
-
- 9.5. .IC Card
-
- General form:
-
-
- .IC V(NODNUM)=VAL V(NODNUM)=VAL ...
-
-
- Examples:
-
-
- .IC V(11)=5 V(4)=-5 V(2)=2.2
-
-
-
- This card is for setting transient initial conditions. It
-
- has two different interpretations, depending on whether the UIC
-
- parameter is specified on the .TRAN card. Also, one should not
-
-
-
-
-
-
-
-
-
-
-
-
-
- 51
-
-
- confuse this card with the .NODESET card. The .NODESET card is
-
- only to help dc convergence, and does not affect final bias solu-
-
- tion (except for multi-stable circuits). The two interpretations
-
- of this card are as follows:
-
-
- 1. When the UIC parameter is specified on the .TRAN card, then
-
- the node voltages specified on the .IC card are used to compute
-
- the capacitor, diode, BJT, JFET, and MOSFET initial conditions.
-
- This is equivalent to specifying the IC=... parameter on each
-
- device card, but is much more convenient. The IC=... parameter
-
- can still be specified and will take precedence over the .IC
-
- values. Since no dc bias (initial transient) solution is com-
-
- puted before the transient analysis, one should take care to
-
- specify all dc source voltages on the .IC card if they are to be
-
- used to compute device initial conditions.
-
-
- 2. When the UIC parameter is not specified on the .TRAN card,
-
- the dc bias (initial transient) solution will be computed before
-
- the transient analysis. In this case, the node voltages speci-
-
- fied on the .IC card will be forced to the desired initial values
-
- during the bias solution. During transient analysis, the con-
-
- straint on these node voltages is removed.
-
-
-
- 9.6. .AC Card
-
-
- General form:
-
-
- .AC DEC ND FSTART FSTOP
-
-
-
-
-
-
-
-
-
-
-
-
- 52
-
-
- .AC OCT NO FSTART FSTOP
- .AC LIN NP FSTART FSTOP
-
-
- Examples:
-
-
- .AC DEC 10 1 10K
- .AC DEC 10 1K 100MEG
- .AC LIN 100 1 100HZ
-
-
-
-
- DEC stands for decade variation, and ND is the number of
-
- points per decade. OCT stands for octave variation, and NO is
-
- the number of points per octave. LIN stands for linear varia-
-
- tion, and NP is the number of points. FSTART is the starting
-
- frequency, and FSTOP is the final frequency. If this card is
-
- included in the deck, SPICE will perform an ac analysis of the
-
- circuit over the specified frequency range. Note that in order
-
- for this analysis to be meaningful, at least one independent
-
- source must have been specified with an ac value.
-
-
-
- 9.7. .TRAN Card
-
-
- General form:
-
-
- .TRAN TSTEP TSTOP <TSTART <TMAX>>
-
-
- Examples:
-
-
- .TRAN 1NS 100NS
- .TRAN 1NS 1000NS 500NS
- .TRAN 10NS 1US
-
-
-
-
-
-
-
-
-
-
-
-
-
-
- 53
-
-
- TSTEP is the printing or plotting increment for line-printer
-
- output. For use with the post-processor, TSTEP is the suggested
-
- computing increment. TSTOP is the final time, and TSTART is the
-
- initial time. If TSTART is omitted, it is assumed to be zero.
-
- The transient analysis always begins at time zero. In the inter-
-
- val <zero, TSTART>, the circuit is analyzed (to reach a steady
-
- state), but no outputs are stored. In the interval <TSTART,
-
- TSTOP>, the circuit is analyzed and outputs are stored. TMAX is
-
- the maximum stepsize that SPICE will use (for default, the pro-
-
- gram chooses either TSTEP or (TSTOP-TSTART)/50.0, whichever is
-
- smaller. TMAX is useful when one wishes to guarantee a computing
-
- interval which is smaller than the printer increment, TSTEP.
-
-
- UIC (use initial conditions) is an optional keyword which
-
- indicates that the user does not want SPICE to solve for the
-
- quiescent operating point before beginning the transient
-
- analysis. If this keyword is specified, SPICE uses the values
-
- specified using IC=... on the various elements as the initial
-
- transient condition and proceeds with the analysis. If the .IC
-
- card has been specified, then the node voltages on the .IC card
-
- are used to compute the intitial conditions for the devices.
-
- Look at the description on the .IC card for its interpretation
-
- when UIC is not specified.
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
- 54
-
-
- 9.8. .FOUR Card
-
-
-
- The .FOUR card used by SPICE2 to request fourier analysis of
-
- outputs has been replaced by the fourier command in nutmeg and
-
- the interactive SPICE3 front end. For details of this command,
-
- see the manuals for these interfaces.
-
-
-
-
-
- 10. APPENDIX A: EXAMPLE DATA DECKS
-
-
-
- 10.1. Circuit 1
-
-
- The following deck determines the dc operating point of a
-
- simple differential pair. In addition, the ac small-signal
-
- response is computed over the frequency range 1Hz to 100MEGHz.
-
-
- SIMPLE DIFFERENTIAL PAIR
- VCC 7 0 12
- VEE 8 0 -12
- VIN 1 0 AC 1
- RS1 1 2 1K
- RS2 6 0 1K
- Q1 3 2 4 MOD1
- Q2 5 6 4 MOD1
- RC1 7 3 10K
- RC2 7 5 10K
- RE 4 8 10K
- .MODEL MOD1 NPN BF=50 VAF=50 IS=1.E-12 RB=100 CJC=.5PF TF=.6NS
- .AC DEC 10 1 100MEG
- .END
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
- 55
-
-
- 10.2. Circuit 2
-
-
- The following deck computes the output characteristics of a MOS-
-
- FET device over the range 0-10V for VDS and 0-5V for VGS.
-
-
-
- MOS OUTPUT CHARACTERISTICS
- .OPTIONS NODE NOPAGE
- VDS 3 0
- VGS 2 0
- M1 1 2 0 0 MOD1 L=4U W=6U AD=10P AS=10P
- .MODEL MOD1 NMOS VTO=-2 NSUB=1.0E15 UO=550
- * VIDS MEASURES ID, WE COULD HAVE USED VDS, BUT ID WOULD BE NEGATIVE
- VIDS 3 1
- .DC VDS 0 10 .5 VGS 0 5 1
- .END
-
-
-
-
- 10.3. Circuit 3
-
-
- The following deck determines the dc transfer curve and the
-
- transient pulse response of a simple RTL inverter. The input is
-
- a pulse from 0 to 5 Volts with delay, rise, and fall times of 2ns
-
- and a pulse width of 30ns. The transient interval is 0 to 100ns,
-
- with printing to be done every nanosecond.
-
-
-
- SIMPLE RTL INVERTER
- VCC 4 0 5
- VIN 1 0 PULSE 0 5 2NS 2NS 2NS 30NS
- RB 1 2 10K
- Q1 3 2 0 Q1
- RC 3 4 1K
- .MODEL Q1 NPN BF 20 RB 100 TF .1NS CJC 2PF
- .DC VIN 0 5 0.1
- .TRAN 1NS 100NS
- .END
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
- 56
-
-
- 10.4. Circuit 4
-
-
-
- The following deck simulates a four-bit binary adder, using
-
- several subcircuits to describe various pieces of the overall
-
- circuit.
-
-
-
- ADDER - 4 BIT ALL-NAND-GATE BINARY ADDER
-
- *** SUBCIRCUIT DEFINITIONS
-
- .SUBCKT NAND 1 2 3 4
- * NODES: INPUT(2), OUTPUT, VCC
- Q1 9 5 1 QMOD
- D1CLAMP 0 1 DMOD
- Q2 9 5 2 QMOD
- D2CLAMP 0 2 DMOD
- RB 4 5 4K
- R1 4 6 1.6K
- Q3 6 9 8 QMOD
- R2 8 0 1K
- RC 4 7 130
- Q4 7 6 10 QMOD
- DVBEDROP 10 3 DMOD
- Q5 3 8 0 QMOD
- .ENDS NAND
- .SUBCKT ONEBIT 1 2 3 4 5 6
- * NODES: INPUT(2), CARRY-IN, OUTPUT, CARRY-OUT, VCC
- X1 1 2 7 6 NAND
- X2 1 7 8 6 NAND
- X3 2 7 9 6 NAND
- X4 8 9 10 6 NAND
- X5 3 10 11 6 NAND
- X6 3 11 12 6 NAND
- X7 10 11 13 6 NAND
- X8 12 13 4 6 NAND
- X9 11 7 5 6 NAND
- .ENDS ONEBIT
- .SUBCKT TWOBIT 1 2 3 4 5 6 7 8 9
- * NODES: INPUT - BIT0(2) / BIT1(2), OUTPUT - BIT0 / BIT1,
- * CARRY-IN, CARRY-OUT, VCC
- X1 1 2 7 5 10 9 ONEBIT
- X2 3 4 10 6 8 9 ONEBIT
- .ENDS TWOBIT
-
- .SUBCKT FOURBIT 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
-
-
-
-
-
-
-
-
-
-
-
-
- 57
-
-
- * NODES: INPUT - BIT0(2) / BIT1(2) / BIT2(2) / BIT3(2),
- * OUTPUT - BIT0 / BIT1 / BIT2 / BIT3, CARRY-IN, CARRY-OUT, VCC
- X1 1 2 3 4 9 10 13 16 15 TWOBIT
- X2 5 6 7 8 11 12 16 14 15 TWOBIT
- .ENDS FOURBIT
-
- *** DEFINE NOMINAL CIRCUIT
-
- .MODEL DMOD D
- .MODEL QMOD NPN(BF=75 RB=100 CJE=1PF CJC=3PF)
- VCC 99 0 DC 5V
- VIN1A 1 0 PULSE(0 3 0 10NS 10NS 10NS 50NS)
- VIN1B 2 0 PULSE(0 3 0 10NS 10NS 20NS 100NS)
- VIN2A 3 0 PULSE(0 3 0 10NS 10NS 40NS 200NS)
- VIN2B 4 0 PULSE(0 3 0 10NS 10NS 80NS 400NS)
- VIN3A 5 0 PULSE(0 3 0 10NS 10NS 160NS 800NS)
- VIN3B 6 0 PULSE(0 3 0 10NS 10NS 320NS 1600NS)
- VIN4A 7 0 PULSE(0 3 0 10NS 10NS 640NS 3200NS)
- VIN4B 8 0 PULSE(0 3 0 10NS 10NS 1280NS 6400NS)
- X1 1 2 3 4 5 6 7 8 9 10 11 12 0 13 99 FOURBIT
- RBIT0 9 0 1K
- RBIT1 10 0 1K
- RBIT2 11 0 1K
- RBIT3 12 0 1K
- RCOUT 13 0 1K
-
- *** (FOR THOSE WITH MONEY (AND MEMORY) TO BURN)
- .TRAN 1NS 6400NS
-
- .END
-
-
-
-
- 10.5. Circuit 5
-
-
-
- The following deck simulates a transmission-line inverter.
-
- Two transmission-line elements are required since two propagation
-
- modes are excited. In the case of a coaxial line, the first line
-
- (T1) models the inner conductor with respect to the shield, and
-
- the second line (T2) models the shield with respect to the out-
-
- side world.
-
-
-
-
-
-
-
-
-
-
-
-
-
-
- 58
-
-
- TRANSMISSION-LINE INVERTER
- V1 1 0 PULSE(0 1 0 0.1N)
- R1 1 2 50
- X1 2 0 0 4 TLINE
- R2 4 0 50
- .SUBCKT TLINE 1 2 3 4
- T1 1 2 3 4 Z0=50 TD=1.5NS
- T2 2 0 4 0 Z0=100 TD=1NS
- .ENDS TLINE
- .TRAN 0.1NS 20NS
- .END
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-